CNC Manufacturing for Semiconductor

Robotika provides precision CNC machining services to the semiconductor industry, with rapid prototype delivery in as fast as 7 days.

10+ years of CNC manufacturing experience in semiconductor
3- to 5-axis CNC, high-speed EDM, and precision molding capabilities
+/- 0.001 inches tolerances on critical dimensions
Uses high-performance materials designed specifically for semiconductor manufacturing
24/7 engineering support

Start Manufacturing Your Semiconductor Parts !

STEP | STP | IGS | IGES | PRT | SLDPRT | SAT | X_T
Max. file size: ≤15MB

Reliable Semiconductor Parts CNC Machining Service Supplier from China

Robotika provides CNC manufacturing services for the semiconductor industry, delivering ultra-precise components that meet the demanding requirements of wafer processing, lithography, and chip packaging equipment. With strong capabilities in quick-turn prototyping and low- to medium-volume production, we produce critical parts such as chambers, precision brackets, cooling plates, and wafer handling components with exceptional accuracy and consistency. Our advantage lies in maintaining tight tolerances, offering contamination-free machining environments, and working with materials like aluminum, stainless steel, titanium, and high-performance plastics to ensure both durability and compatibility with semiconductor processes.

In addition to machining, Robotika offers value-added services including material consultation, surface treatments to enhance corrosion resistance and cleanliness, and comprehensive CMM inspection to guarantee precision. With more than 10 years of experience and over 100,000 parts delivered annually, we support global semiconductor equipment manufacturers, wafer fabrication plants, and advanced electronics companies in building reliable, high-performance systems.

What kind of semiconductor parts can we make?

Robotika manufactures a wide range of CNC-machined components for the semiconductor industry, including vacuum chambers, wafer handling arms, precision brackets, cooling plates, gas distribution blocks, and alignment fixtures used in wafer fabrication, lithography, and packaging equipment. To meet the stringent requirements of cleanroom environments and ultra-precise operations, we work with materials such as high-purity aluminum alloys for lightweight and thermal conductivity, stainless steel and titanium for corrosion resistance and durability, and advanced engineering plastics like PEEK and PPS for insulation and low particle generation. We also provide specialized surface finishes, including anodizing, electropolishing, bead blasting, and nickel plating. All parts have 0.001-inch tolerances.

Vacuum chambers
Wafer handling arms
End effectors
Cooling plates
Heat sinks
Gas distribution blocks
Alignment fixtures
Reticle holders

Wafer chucks
Robot brackets
Precision nozzles
Pump housings
Valve bodies
Manifold blocks
Bearing housings
Guide rails

Sensor mounts
Optical component holders
RF shields
Transfer stage components
Frame structures
Spacers and insulators
Clamping rings
Polishing head components

Semiconductor CNC Machining Capabilities

Supported Materials

We specialize in machining semiconductor-grade materials including aluminum alloys (6061, 7075), titanium (Ti-6Al-4V), stainless steel (304, 316L), and high-performance plastics like PEEK and PTFE, meeting the strict requirements of semiconductor applications.

Machining Accuracy

Standard tolerance is maintained within ±0.01mm to ensure high precision for critical semiconductor components.

Maximum Machining Size

Up to 1000mm × 600mm × 500mm, suitable for a wide range of semiconductor parts.

Surface Finishing Options

Anodizing, polishing, bead blasting, powder coating, and other finishes enhance durability and performance.

Delivery Time

Typical lead time is 5–10 days, with expedited services for urgent semiconductor projects.

Experience the boundless possibilities of customization

Enhance your semiconductor components with precision machining and advanced surface finishes. At Robotika, we tailor each part to your exact specifications—including material selection, geometry, and coating—ensuring high performance, reliability, and full compliance with semiconductor industry standards.

Name	Tolerance Range
Standard Semiconductor Parts	±0.1 mm to ±0.3 mm
Precision Semiconductor Parts	±0.01 mm to ±0.1 mm
Complex Semiconductor Parts	±0.02 mm to ±0.15 mm

Name	Description	Can Be Applied with
Anodizing	Enhances corrosion resistance, surface hardness, and electrical insulation.	Aluminum semiconductor housings, heat sinks, frames
Polishing / Buffing	Smooths surfaces, reduces friction, improves reflectivity.	Wafer holders, precision plates, optical mounts
Bead Blasting	Creates uniform matte texture, removes burrs.	Structural brackets, alignment fixtures
Powder Coating	Provides durable, chemical-resistant coating.	External enclosures, protective casings
Electroplating / Nickel Plating	Adds corrosion and wear resistance, improves surface conductivity.	Connectors, contact pads, mounting hardware
Painting / Color Coating	Adds protective layer and visual differentiation.	Equipment panels, housings
Passivation	Removes free iron, enhances corrosion resistance.	Stainless steel parts in cleanroom environments
Electropolishing	Polishes and passivates simultaneously, improves cleanliness and smoothness.	Stainless steel trays, chemical handling components

Aluminum Alloys (6061, 7075)

Aluminum alloys (6061, 7075) are the workhorses of semiconductor CNC machining. 6061’s balanced strength and thermal conductivity make it perfect for clean-room housings, wafer-cassette frames, and liquid-cooled heat sinks that must dissipate heat without particle shedding. 7075 adds aerospace-grade tensile strength and fatigue resistance, ideal for robotic end-effectors and fixture plates that cycle millions of times without deformation. Both alloys accept Type II/III anodizing, chem-film, and nano-ceramic coatings that boost surface hardness and EMI shielding while meeting ISO 14644 cleanliness standards.

Mill Lead Time: Up to 3 days
Finishes: Raw, anodized, bead blasted, polished

Stainless Steel (304, 316L)

304 and 316L stainless steels provide outstanding corrosion, chemical, and high-temperature resistance demanded by semiconductor cleanrooms. 304 forms the backbone of wafer-transfer trays, chamber brackets, and support rails that endure repeated acid and solvent cleaning. 316L’s added molybdenum resists chloride attack in CMP slurry environments, ensuring long-term dimensional stability. CNC machining yields burr-free edges, precise tapped holes, and mirror finishes ready for passivation or electropolishing, eliminating particle traps and extending component life through thousands of thermal cycles.

Mill Lead Time: Up to 3 days
Finishes: Passivation, polishing, bead blasted

Titanium (Ti-6Al-4V)

Ti-6Al-4V combines the highest strength-to-weight ratio with immunity to galvanic corrosion and extreme temperatures—critical for vacuum chambers, robotic arms, and high-precision fixtures inside semiconductor tools. Its stiffness minimizes deflection under heavy wafer loads, while non-magnetic properties preserve sensitive sensor readings. CNC machining achieves ±0.01 mm tolerances on complex contours; Type II anodizing adds vibrant color-coding for tool identification, and electropolishing creates ultra-smooth, particulate-free surfaces that meet stringent cleanroom protocols.

Mill Lead Time: Up to 3 days
Finishes: Raw, anodized, bead blasted, polished

Copper & Copper Alloys

High-purity coppers such as C110 and free-machining C360 deliver exceptional electrical and thermal conductivity essential for semiconductor heat sinks, RF feedthroughs, and grounding plates. C110’s 101 % IACS rating ensures minimal insertion loss in high-frequency test fixtures, while C360’s machinability reduces cycle time on precision contact pins. CNC machining holds ±0.01 mm concentricity and Ra ≤ 0.4 µm finishes; selective silver, tin, or nickel plating enhances solderability and oxidation resistance, enabling RoHS-compliant assemblies that exceed IPC-2221 performance specifications.

Mill Lead Time: Up to 3 days
Finishes: Polished, electroplated, raw

PEEK

PEEK withstands continuous 250 °C operation, aggressive chemicals, and high radiation—making it indispensable for semiconductor robotic arms, vacuum-compatible clamps, and high-precision insulating supports. Its dimensional stability ensures accurate, repeatable motion under mechanical and thermal stress, while inherent purity meets ISO 14644 and FDA requirements. Carbon or glass-filled grades add ESD dissipation and stiffness, and CNC machining produces intricate geometries with smooth, particulate-free finishes ideal for cleanroom use.

Mill Lead Time: Up to 3 days
Color: Black, neutral matte finish

PTFE

PTFE’s ultra-low coefficient of friction and broad chemical resistance make it the material of choice for sliding guides, seals, and electrical insulation inside semiconductor process chambers. It maintains dimensional stability across wide temperature swings and resists attack from acids, bases, and solvents. CNC machining delivers ±0.01 mm tolerances on miniature valve seats and connector insulators, ensuring leak-free performance and long service life in aggressive media.

Mill Lead Time: Up to 3 days
Color: White or neutral matte finish

ABS / PC

ABS and PC combine excellent impact resistance, dimensional stability, and ease of machining—perfect for test fixtures, equipment enclosures, and low-load supports in semiconductor manufacturing. ABS offers cost-effective toughness for prototypes, while PC adds optical clarity and higher thermal resistance for transparent covers and safety shields. CNC processing enables complex geometries and snap-fit features without secondary tooling, while UV-stable and antistatic grades meet cleanroom and ESD requirements.

Mill Lead Time: Up to 3 days
Color: Black, neutral matte finish

Carbon Fiber Reinforced Plastics

Carbon fiber composites deliver exceptional stiffness-to-weight ratios, thermal stability, and EMI shielding for semiconductor robotic arms, precision support frames, and high-accuracy positioning fixtures. Tailored lay-ups optimize torsional rigidity and minimize thermal expansion, ensuring micron-level repeatability under vacuum and temperature cycling. CNC machining maintains ±0.01 mm tolerances and smooth edges, while matte finishes reduce glare and particle shedding in cleanroom environments.

Mill Lead Time: Up to 3 days
Color: Black, neutral matte finish

Glass Fiber Reinforced Plastics

GFRP provides high heat resistance, chemical stability, and mechanical strength for semiconductor housings, support frames, and guide components exposed to aggressive chemistries and rapid thermal cycles. Its dimensional stability and lightweight nature enable machining of precise parts that withstand mechanical stress without creep. UV-stable gel coats and EMI-compatible coatings extend service life and meet FCC emissions limits for outdoor telecom enclosures.

Mill Lead Time: Up to 3 days
Color: Gray or neutral matte finish